WILDSTAR A10 2PE for 6U OpenVPX – WB6A12

General Features

• Two Intel Arria 10® GX900, GX1150, GT1150 FPGAs
  • Up to 6,072 18×19 Multipliers per board
  • Up to 2,300,000 logic elements per board
  • GTH transceivers operating up to 15 Gbps
  • Hard 8x PCIe Gen3 endpoint for DMA and register access
  • FPGAs programmable from attached flash or Annapolis provided software API
  • 20-nm copper CMOS process
  • DDR4 DRAM ports running up to 2666 MT/s
    • Two 72-bit ports per FPGA
    • Up to 32 GB/FPGA, up to 64 GB/board
    • Up to about 44 GB/s per FPGA
    • ECC optional
  • QDR-IV SRAM ports running up to 2132 MT/s (optional for IOPEs)
    • Replaces IOPE DDR4 DRAM
    • Two 72-bit ports per IOPE
    • Up to 32 MB/FPGA, up to 64 MB/board
    • Up to about 38.4 GB/s per FPGA
    • ECC optional
• Dual Core ARM Cortex-A9 Processor (Cyclone V SoC)
  • Host Software: Linux API and Device Drivers
  • Each core runs up to 925 MHz
  • 1 GB of DDR3 DRAM
  • 8GB eMMC and 16MB NOR Boot Flash
  • 4x PCIe Gen1 connection to on-board PCIe Switch
• PLX PCI Express Gen3 Switch
  • Allows data plane “chaining” of PCIe bus between adjacent slots. No dedicated PCIe switch slot needed.
  • Allows access from a single PCIe connection to both SoC CPU and FPGA

Backplane I/O

• 24x High Speed Serial IO lanes to VPX Backplane (P1/P4) for 60 GB/s of Full Duplex Bandwidth
• Two PCIe Gen3 4x Connections to VPX Backplane (P1)
• 32 LVDS and 8 Single Ended lines to P3
• Backplane Protocol Agnostic connections support 10/40Gb Ethernet, IB capable, AnnapMicro protocol and user designed protocol
• External clock and IRIG-B Support via Backplane
• Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK
  • Allows points-to-point, very high quality backplane connections to payload cards
  • Allows 10MHz clock and trigger from backplane to synchronize and clock compatibleADC/DAC mezzanine cards without front panel connections needed
  • Allows 1000s of analog channels across many backplanes/chassis to besynchronized via backplane

Front Panel IO

• Two WILD FMC+ (WFMC+) next generation IO site based on FMC+ specification
  • Accepts standard FMC and FMC+ cards (complies to FMC+ specification)
  • Allows larger form factor Annapolis cards for higher IO density
  • Supports additional LVDS IO for higher density ADC and DAC solutions
  • Supports stacking (2 IO cards per site) when at least one card is WFMC+
  • Up to 32 High Speed Serial and 100 LVDS connections to FPGA
  • Support for double wide cards
• Simultaneous Optics and ADC/DAC use with two slots
• Protocol Agnostic HSS connections support 10/40/100 Gb Ethernet, IB capable, AnnapMicro protocol and user designed protocols
• SMA for clock in, clock out or IRIG-B in supporting multiple IO standards and terminations.
• Micro USB connector for CPU serial port (uses USB to UART bridge chip)

Application Development

• Open Project Builder Application Design Suite
  • Full Board Support Package for Fast and Easy Application Development
  • Computational, DSP and Data Flow Control Cores (FFTs, FIR, Math, etc)
  • Develop in GUI environment or create VHDL and use HDL environment
  • Built-in Debugger for Hardware in the loop Debugging
  • Communication Cores Included (10/40Gb Ethernet and AnnapMicro Protocol cores)
  • VHDL Model includes Source Code for Hardware Interfaces
  • Supports High-Level Synthesis (HLS) Design Flow
• VHDL BSP packages including full synthesis and simulation support
• JTAG Access through RTM, Ethernet, or PCIe
• Board control and status monitoring can be local (stand alone), remote (via Ethernet or PCIe) or hybrid (both local and remote)

System Management

• System Management using PCIe Intelligent Platform Management Interface (IPMI)
• Diagnostic monitoring and configuration
• Current, Voltage and Temperature Monitoring Sensors
• Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)

Mechanical and Environmental

• 6U OpenVPX (VITA 65) Compliant, 1” VITA 48.1 spacing
• Supports OpenVPX payload profile:MOD6-PAY-4F1Q2U2T-12.2.1-n
• Integrated Heat Sink and Board Stiffener
• Available in Extended Temperature Grades
• Air or Conduction Cooled path
• RTM available for additional I/O

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Technical Documents

• Datasheet

For additional documentation, please contact your Sales Representative.