WILDSTAR 3XV5 3U OpenVPX FPGA Processor – WB3XV5

The WILDSTAR 3XV5 integrates Xilinx's new Versal™ Premium VP2502 FPGA with 472 AI Engines. It is 100GbE-enabled, SOSA-aligned, and highly rugged and thermally-controlled.

Need the same Versal power and SOSA alignment and 100GbE capability in a 6U VPX form factor? See the WILDSTAR 6XV4 6U OpenVPX Board.

These SOSA-aligned Plug-In Cards (PIC) include one Versal Premium VP2502 FPGA with AI Engines. AMD’s new Versal Premium Adaptive Compute Accelerated Platform (ACAP) with AI Engines are engineered for high-performance signal processing applications like radar, electronic warfare, and signal intelligence applications. In addition to being able to run AI models more efficiently, the addition of the AI engines allows the signal processing workloads to be split between the DSP and AI engines, using each most efficiently for the relative tasks, with improved overall performance.

The 3XV5 also has superior connectivity. It offers an optional front panel RS422/RS485 GPIO interface and 2/3×40/100G Optical Transceivers to VITA 66 backplane interface.

Additional flexibility is built into a high bandwidth next-generation mezzanine site that is optimized for JESD-based ADCs and DACs or optical transceivers.

Review other OpenVPX 3U and Xilinx FPGA boards.

General Features

  • One Versal™ Premium VP2502 FPGA
    • 7,392 DSP Slices and 3,737,720 logic cells
    • 366 Mb of High Bandwidth, Low Latency UltraRAM
    • 472 AI Engines
    • 118 Mb AI Engine Data Memory
    • Five 32-bit LPDDR4 DRAM ports running up to 3700 MT/s
    • Dual-core 64-bit ARM® Cortex-A72 running up to 1.4GHz
    • Dual-core 32-bit Cortex-R5F real-time processor running up to 600MHz
  • Optional Front panel RS422/RS485 GPIO interface
  • Optional 2/3×40/100G Optical Transceivers to VITA 66 Backplane Interface
  • Multiple levels of hardware and software security

Next Generation “WILDSTAR Mezzanine Card HSS” (WMC-H) Site

  • Optimized for JESD-based ADCs and DACs or Optical Transceivers
    • For High Bandwidth Applications
    • Annapolis Mezzanine products with “WH” prefix
  • SOSA Aligned backplane I/O
  • Optimized for VITA 66/67 interfaces
  • Optimized for cooling
  • Allows larger form factor cards for higher IO density
  • Based on FMC+
  • Available options:
    • WHDMF1: Jariet Electra-MA: 2TX (64GSps)/2RX (64GSps)
    • Xilinx RFSoC: 2TX (5GSps)/8RX (5GSps)
    • Xilinx RFSoC: 4TX (5GSps)/4RX (5GSps)
    • Others covered under NDA. Contact Factory for more information.

Mechanical and Environmental

  • 3U OpenVPX (VITA 65) Compliant, 1” VITA 48.2 spacing
  • Supports OpenVPX payload profile:
    • SLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11-n
  • Available with 85C ambient air temperature or card edge support and -55C power-on
  • Available with -65C to 105C storage temperature
  • Air, Air-Flow-Through or Conduction Cooled
  • Only requires +12V and +3.3VAUX from backplane
  • Developed in alignment with the SOSA™ Technical Standard 1.0
  • RT3 backplane connectors for 100G support

Application Development

  • Full Board Support Package for fast and easy Application Development
  • Includes source for all provided software components and examples on Versal PEs
  • Open CoreFire Next™ support
    • HDL generation
  • Three development flow paths:
    • Traditional RTL development flow
      • HDL/IPI -> Vivado™ -> PetaLinux project -> Bitstream
    • *NEW* Dynamic Function eXchange (DFX) RTL development flow
      • Includes abstract shell approach which avoids PetaLinux rebuilds on iterations
      • Design refactors and testing iterations significantly sped up
      • CIPs function remains active while fabric is reloaded
    • *NEW* Vitis™ Platform Project development flow

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Technical Documents

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