WILDSTAR 6XV8 6U OpenVPX FPGA Processor – WS6XV8

The WILDSTAR 6XV8 integrates one of AMD Xilinx's new Versal™ Premium VP1702 FPGAs. It is 100GbE-enabled, SOSA-aligned, and highly rugged and thermally-controlled. This is the most cost and power optimized of our 6U Versal baseboards.

Need the same Versal power and SOSA alignment and 100GbE capability in a smaller package? See the WILDSTAR 3XV1 3U OpenVPX Board.

These FPGA boards are SOSA-aligned Plug-In Cards (PIC). They include one Versal Premium VP1702 FPGA and have eight 32-bit LPDDR4 DRAM ports running up to 3732 MT/s.

There is also an on-board dual ARM CPU running up to 1.4 GHz which can be used for local application requirements.  It is accessible over backplane PCIe or Ethernet and provides dedicated AXI interfaces to all FPGAs.  It is also used to query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1 or 10GbE.

WILDSTAR 6XV8 6U OpenVPX FPGA Processor boards are hot swappable in air cooled environments allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable, so a whole chassis does not need to be shutdown to remove a single board.

Review other OpenVPX 6U and Xilinx FPGA boards.

 

General Features

  • One Versal™ Premium VP1702 FPGA
    • Up to 10,896 DSP Slices and 5,558,000 logic cells
    • Up to 717 Mb of High Bandwidth, Low Latency UltraRAM
    • Eight 32-bit LPDDR4 DRAM ports running up to 3732 MT/s
    • Dual-core 64-bit ARM Cortex-A72 running up to 1.4GHz
    • Dual-core 32-bit Cortex-R5F real-time processor running up to 450MHz
    • 40GB SLC NVMe SSD with multiple security modes and hardware lock
  • Multiple levels of hardware and software security
  • Up to eighteen 100G Optical Transceivers to VITA 66 Backplane Interface

Mechanical and Environmental

  • 6U OpenVPX (VITA 65) Compliant, 1” VITA 48.2 spacing
  • Supports OpenVPX payload profile:
    • SLT6-PAY-4F2Q1H4U1T1S1S1TU2U2T1H-10.6.4-n
  • Liquid-Flow-Through (LFT) or Conduction Cooled (CC)
    • CC available with -40 C to 60 C cold wall operational temperature (CCW3)
    • LFT available with -40 C to 50 C coolant operational temperatures
      • LFT supported coolants include PAO and EGW
      • LFT coolant pressure drop tunable via orficing
    • CC/LFT available with -62 C to 105 C storage temperature
  • Only requires +12V and +3.3VAUX from backplane
  • Developed in alignment with the SOSA™ Technical Standard
  • RT3 backplane connectors for 100G support

 

Application Development

  • Full Board Support Package for fast and easy Application Development
  • Includes source for all provided software components and examples on Versal PEs
  • Open CoreFire™ support
    • HDL generation
  • Three development flow paths:
    • Traditional RTL development flow
      • HDL/IPI -> Vivado™ -> PetaLinux project -> Bitstream
    • *NEW* Dynamic Function eXchange (DFX) RTL development flow
      • Includes abstract shell approach which avoids PetaLinux rebuilds on iterations
      • Design refactors and testing iterations significantly sped up
      • CIPs function remains active while fabric is reloaded
    • *NEW* Vitis™ Platform Project development flow

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Technical Documents

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