WILDSTAR 3SN0 3U OpenVPX Storage – 48 TB/Slot – WB3SN0

When Storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market, with up to 48.0 TB of capacity in a single 1” 3U slot. This hot-swappable board (10,000 insertion cycles) is 100GbE capable, and is developed in alignment with SOSA™.

Annapolis Storage Solutions are optimized for SIGINT, ELINT, EW, or other high-bandwidth storage applications.

The 3U WILDSTAR Data Storage Solution features up to 48 TB storage depth, plus additional depth and bandwidth capacity using multiple Cards.

One Xilinx® Zynq® UltraScale+™ MPSoC ZU11 Motherboard Controller allows stand-alone operation, and supports multiple levels of hardware and software security.

The Board has a rugged design and is available in industrial temperature grades. Optional air, conduction, air-flow-through, and liquid-cooled environments.

High-bandwidth backplane connectivity is enabled by MULTIGIG RT3 interconnects, which deliver 100Gb per Fat Pipe.

The 3SN0 is part of Annapolis’ growing Wild100 EcoSystem™, an interoperable portfolio of rugged high-performance 100Gb VPX COTS boards and systems.

 

General Features

  • 8.0 / 12.0 / 24.0 / 48.0 TB storage depth in a single 1” 3U slot
  • Scalable Depth and Bandwidth using multiple Storage Cards
  • Supports NVMe over Fabrics for Network Attached Storage
  • Multiple types of encryption supported
  • Hot Swappable with 10,000 Insertion Cycles (exclusive to WILD OpenVPX EcoSystem)
  • Developed in alignment with SOSA™

One Xilinx® Zynq® UltraScale+™ MPSoC ZU11 Motherboard Controller

  • Allows for non-PCIe based interfaces such as 100GbE or user defined protocols
  • Includes 100GbE IP
  • Allows stand-alone operation
  • Processing Subsystem (PS)
    • Quad-core 64-bit ARM® Cortex-A53
    • Dual-core 32-bit Cortex-R5 real-time processor
    • Mali-400 MP2 graphics processing unit
    • One 64-bit, 4 GB DDR4 memory
    • 256Kb user SPI FRAM
  • Programmable Logic (PL)
    • Up to 2928 DSP slices or 1,143,00 logic cells
    • Up to 36Mb of High Bandwidth, Low Latency UltraRAM
    • Gen3 PCIe, 150G Interlaken and 100Gb Ethernet Hard Cores
    • GTH/GTY transceivers operating up to 32.75 Gb/s
    • 256Kb user SPI FRAM
  • 16nm FinFET+ process
  • Board support enabling user customization of ZYNQ+ design
  • Multiple levels of hardware and software security

Backplane I/O

  • Backplane I/O using PCIe or 100Gb Ethernet
  • Dual 4x PCIe Gen3 backplane interfaces
  • On-board PCIe Gen3 switch
    • Allows daisy chaining of boards without system switch in chassis

System Management

  • 3U OpenVPX (VITA 65) Compliant, 1” VITA 48.1 spacing
  • Current, Voltage and Temperature Monitoring Sensors
  • Front panel status LEDs for drives and PCIe link status
  • Proactive Thermal Management

Application Development Board Support Package

  • Open Project Builder Application Design Suite
  • Full Board Support Package for Fast and Easy Application Development
  • Computational, DSP and Data Flow Control Cores (FFTs, FIR, Math, etc)
  • Develop in GUI environment or create VHDL and use HDL environment
  • Built-in Debugger for Hardware in the loop Debugging
  • Communication Cores Included (10/40/100Gb Ethernet, AnnapMicro Protocol)
  • VHDL Model includes Source Code for Hardware Interfaces
  • Supports High-Level Synthesis (HLS) Design Flow
  • VHDL BSP packages including full synthesis and simulation support
  • Support for Mathworks HDL Coder™ generated IP

Mechanical and Environmental

  • 3U OpenVPX Compliant 1.0″ spacing
  • Optional VITA 66 support
  • RT3 backplane connectors for 100G support
  • Integrated Heat Sink and Board Stiffener
  • Available in Industrial Temperature Grades
  • Available for Air, Conduction, Air-Flow-Through, and Liquid-cooled environments
  • RTM available for additional I/O
  • Hot Swappable (exclusive to WILD OpenVPX EcoSystem)
  • Only requires +12V and Optionally +3.3VAUX from backplane
  • Developed in alignment with the SOSA™ Technical Standard

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Technical Documents

For additional documentation, please contact your Sales Representative.

 

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